"Currently, we flip COB- ceramic matrix LC003 has been marketed as a typical product of high-density LED array, it can provide more feasibility to use LED lighting in high-density applications in the field of lumens." Hongli Wang Gaoyang, director of optoelectronic products , mentioned in a speech on the high-tech LED good products tour Huizhou station on May 19 .
It is reported that the core advantages of flip-chip packaging are numerous, including the following four characteristics: 1. Solder-free wire, better reliability; 2. Low thermal resistance; 3. Ultra-high current drive; 4. Different solid crystal technology can be used. For example, a eutectic process, a silver paste process, and a solder paste process.
At the same time, Hongli Optoelectronics is a key high-tech enterprise in the National Torch Program, which is committed to the research and production of high-end LED. The company has domestic leading white LED packaging technology and high-power LED packaging technology. In 2012 and 2013, China's lighting white LED packaging enterprises competed. Ranked first in the force, the first domestic COB package output value in 2014 (GLII ranking).
"The flip-chip device we introduced is more consistent due to the white light wafer process and the phosphor molding technology. The MacAdam ellipse has three levels of controllable white light concentration; it uses a high thermal conductivity material and has a thermal resistance of 6 °C. /W, can reduce Tj; solder paste eutectic thermal conductivity of 57W / m · k, ceramic substrate heat dissipation." Wang Gaoyang said that based on the above advantages, it can be flexibly applied to mobile phone flash, TV backlight, lighting and other applications.
In addition, when talking about the development trend of AC modules, Wang Gaoyang said that it has three major advantages: "First, the same power conversion efficiency, under the same power factor, AC products are reduced by more than 5% than DC products. Assembly hours are reduced, Reduce labor costs; Second, electrical parameters: η>85% PF>0.95 THD<20%, the overall lighting efficiency is 95lm/W, Ra=80; Third, assembly, direct mains drive, convenient for customer assembly, reduce The volume of the lamp body, the third generation of integrated die products, will reduce the volume of the lamp body by more than 10%."
Wang Gaiyang, Director of Hongli Optoelectronics Products
It is reported that the core advantages of flip-chip packaging are numerous, including the following four characteristics: 1. Solder-free wire, better reliability; 2. Low thermal resistance; 3. Ultra-high current drive; 4. Different solid crystal technology can be used. For example, a eutectic process, a silver paste process, and a solder paste process.
At the same time, Hongli Optoelectronics is a key high-tech enterprise in the National Torch Program, which is committed to the research and production of high-end LED. The company has domestic leading white LED packaging technology and high-power LED packaging technology. In 2012 and 2013, China's lighting white LED packaging enterprises competed. Ranked first in the force, the first domestic COB package output value in 2014 (GLII ranking).
"The flip-chip device we introduced is more consistent due to the white light wafer process and the phosphor molding technology. The MacAdam ellipse has three levels of controllable white light concentration; it uses a high thermal conductivity material and has a thermal resistance of 6 °C. /W, can reduce Tj; solder paste eutectic thermal conductivity of 57W / m · k, ceramic substrate heat dissipation." Wang Gaoyang said that based on the above advantages, it can be flexibly applied to mobile phone flash, TV backlight, lighting and other applications.
In addition, when talking about the development trend of AC modules, Wang Gaoyang said that it has three major advantages: "First, the same power conversion efficiency, under the same power factor, AC products are reduced by more than 5% than DC products. Assembly hours are reduced, Reduce labor costs; Second, electrical parameters: η>85% PF>0.95 THD<20%, the overall lighting efficiency is 95lm/W, Ra=80; Third, assembly, direct mains drive, convenient for customer assembly, reduce The volume of the lamp body, the third generation of integrated die products, will reduce the volume of the lamp body by more than 10%."
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