Display applications have long been the main appeal of LED light-emitting components, and LEDs are not required to have high heat dissipation. Therefore, LEDs are mostly packaged directly on general resin-based substrates. However, with the development of high-luminance and high efficiency of LEDs since 2000, especially The luminous efficiency of blue LED components has been greatly improved, and liquid crystal, home appliances, automotive and other companies have begun to actively review the applicability of LEDs.
Nowadays, the rapid popularization of digital home appliances and flat-panel displays, coupled with the continuous decline in the cost of LEDs, has led to the expanding range of LED applications and the willingness to adopt LEDs. Among them, LCD panel manufacturers are facing the guidance of hazardous substances issued by the European Union. (RoHS: Restriction of Hazardous Substances Directive), and the development policy of mercury-free cold cathode fluorescent lamp (CCFL) has been proposed in the future. As a result, the demand for high-power LEDs is more urgent.
Technically, high-power LED packaged products are very difficult to use when dissipating heat. In this context, products with high cost efficiency and high heat dissipation package substrates such as metal-based substrates are becoming more and more efficient. A high-profile focus.
Epoxy resin does not meet high power requirements
In the past, the output power of LEDs was small, and the substrate can be packaged with a glass epoxy resin such as a conventional FR4. However, the luminous efficiency of high-power LEDs for illumination is only 20% to 30%, and the chip area is very small, although the overall power consumption is very low, The heat per unit area is very large.
Automotive, lighting and general people's livelihood operators have begun to actively review the applicability of LEDs. The characteristics expected by high-power LEDs are power saving, high brightness, long life and high color reproducibility, which means high heat dissipation is high. The power LED package substrate is indispensable.
Most of the heat dissipation limits of resin substrates only support LEDs of 0.5 W or less. Most LED packages of more than 0.5 W are replaced with metal-based and ceramic-based high-heat-dissipating substrates. The main reason is that the heat dissipation of the substrate has a direct impact on the life and performance of the LED. Therefore, the package substrate is a very important component in designing high-luminance LED products.
The metal-based high-heat-dissipating substrate is divided into two types: a rigid and a flexible substrate. The hard-based substrate belongs to a conventional metal substrate. The thickness of the metal substrate is usually greater than 1 mm, and is widely used in LED lamp modules and illumination. The module, technically it has the same level of high thermal conductivity extension as the aluminum substrate, and is expected to be used in high power LED packages in the future.
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