Internet of Things business opportunities are attracting attention, but there are still no killer applications. In view of this, IC design operators are beginning to have a M-type competition model. One end of the M-word emphasizes traditional economies of scale, and the other end is a special-purpose application. However, if the industry wants to deploy a special application market, most of them must try to integrate different industries. .
Hong Chunhui, industry consultant and director of the Institute of Industrial Intelligence (MIC), said that the Internet of Things has given IC design operators an M-type competition model, with one emphasis on traditional economies of scale and the other on special applications.
Hong Chunhui, Industry Consultant and Director of the Institute of Industrial Intelligence (MIC), said that at this stage, IC design companies will not give up the traditional 3C product market, but such markets are still unable to break the scope of low-cost and competition production; On the other hand, in order to find a better source of revenue, manufacturers have begun to deploy special applications such as smart manufacturing, smart cars and smart medical.
Compared to consumer electronics, these special areas span different categories, allowing IC designers to have a high degree of cross-domain integration in the era of the Internet of Things. For example, if a wearable device emphasizes the health management or even medical use of the device, its built-in sensor must comply with medical regulations and standards to ensure the reliability of the device.
Hong Chunhui believes that for sensor IC manufacturers, they have more resources and are more capable of cross-domain integration to provide a complete set of solutions. For small and medium-sized manufacturers, they need to find cooperation in different areas. Partners, together form a business alliance.
The biggest feature of the Internet of Things is that there is no mainstream application at this stage, and there is a lot of room for development. No matter whether it is food and clothing, there is much to be done; but the biggest challenge for IC designers is also because it has to be integrated with downstream manufacturers. Instead of just selling a chip/sensor, you're going to add value to your customers, such as an app (APP) or a deeper cloud service.
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