Freescale's 32-bit automotive microcontroller, the MPC563xM series, introduces advanced emission control technology designed to help lower carbon dioxide emissions. This innovative series includes three 32-bit powertrain MCUs that are specifically optimized for small engines with one to four cylinders, enhancing both efficiency and performance. Built on Power Architecture technology, these devices not only offer integrated emissions control features but also meet the cost requirements of engine and transmission suppliers. They are fabricated using a 90nm process, ensuring high performance at a competitive price.
The MPC563xM Powertrain MCU integrates a powerful digital signal processing (DSP) engine based on the e200 core, which significantly improves fuel economy and engine performance while reducing engine knocking. This DSP functionality, utilizing SIMD processing, also serves as a patented sensor diagnostic system, helping to resolve real-world vehicle issues. As a result, CO2 emissions can be reduced by up to 5%, contributing to a more sustainable future.
With over 820 million vehicles worldwide, each emitting an average of 4 tons of CO2 annually, the total global CO2 emissions from cars reach 3.3 billion tons. A 5% reduction in these emissions could cut annual CO2 levels by 1.65 tons per vehicle, making a significant impact on global warming. In the U.S., CO2 accounts for over 80% of all greenhouse gas emissions, highlighting the urgent need for cleaner technologies.
The MPC563xM series was developed in collaboration with STMicroelectronics, offering a dual-source option that reduces supply chain risks for automotive customers. Key features include the Power Architecture e200z3 core with clock speeds of 40 MHz, 60 MHz, and 80 MHz; a SIMD module for efficient DSP and floating-point operations; variable-length encoding (VLE) to improve code density; and flash memory options ranging from 768 KB to 1.5 MB. It also includes 81 KB of SRAM, 32-channel eTPU2 for complex timing tasks, hardware-based anti-knock filtering via DMA, two FlexCAN interfaces, two eSCI ports, two DSPIs, a 34-channel ADC, a junction temperature sensor, and multiple package options such as 100LQFP, 144LQFP, 176LQFP, and 08 MAPBGA.
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