LG Display proposes termination of partnership with Cree

[High-tech LED News] According to a South Korean media report, South Korea's LG Display (LGD) will terminate the Memorandum of Understanding (MOU) signed with the US LED chip factory Cree. LGD said its cooperation content has no meaning, but has not yet received Cree. Confirmed in terms.

It is understood that LGD signed a memorandum of cooperation with Cree in 2009 to stabilize the supply of LED chips required for LCD displays. For LG's proposed termination of cooperation, the industry generally believes that in addition to Cree, LGD can also obtain LED chips through other means, such as related company LG Innotek, the current LED chip production rate has been improved, and other operators can be used. The LED chip is patented and can save on licensing fees.

On the other hand, LGD has also adopted a diversified business model for LED-related product suppliers, such as the establishment of a new LED packaging company with Taiwan LCD TV foundry Ruixuan and mainland LED packaging factory Yiguang.

LGD is currently transforming its business, investing in many resources, and LEDs are one of the areas where the industry focuses on development. Although the LGD parts-related business continues to generate revenue for the industry, it is also actively working with other players to establish strategic alliances to invest in end-consumer electronic goods.

Description of Stacked D-Sub I/O Connectors
Antenk's connectors are designed for applications requiring multiple connector ports with limited PCB space
The condensed footprint of Antenk's dual port D-sub solution is available in four industry sizes, three connector spacing options, and six hardware configurations for one of the broadest stacked D-sub offerings on the market in standard and high-density variations.

Stacked D-sub I/O Connectors are designed for applications requiring multiple connector ports with limited PCB space. Two right angle D-sub connectors are stacked one on top of another, creating a single dual-port connector with a very condensed footprint.

Features  of Stacked D-Sub I/O Connectors
Available in four industry standard sizes:
Standard Density : 9, 15, 25, 37
Available in three connector spacing options: 0.625", 0.750", 0.900"
Available in six hardware configurations
High-temperature UL94 V-0 thermoplastic (260°C process temp)
High performance stamped contacts

Applications of Stacked D-Sub I/O Connectors
Communications
Instrumentation
Medical
Computers/peripherals
Commercial industry
Test labs
Gaming industry

Range of of Stacked D-Sub I/O Connectors

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Female Stacked D sub Connector
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High Density Stacked D sub Connector
Dual-Port Stacked D-Sub Connectors

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ShenZhen Antenk Electronics Co,Ltd , https://www.antenk.com

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