A number of photovoltaic companies recently announced their 2011 shipments or sales contract expectations. Judging from the existing data, although the market will grow next year, the increase is already slower than in 2010.

Industry leader Suntech Power Co., Ltd. issued a forecast on December 6, saying that the company's annual sales of photovoltaic cells in 2011 will be no less than 2.2G watts, a significant increase compared to 1.5G watts this year. Compared with 2010, the company's year-on-year increase will reach more than 110%, and its 46% year-on-year increase in 2011 will be far behind this year.

In addition, Yingli Green Energy estimates that it will be able to achieve 1Gwatt of module sales in 2010, and the company stated that the sales contract for next year will be above 1GW. Even if its sales contract is equal to production capacity, which is 1.6Gw at the end of 2011, the increase is only 60%, which is also lower than the increase in global PV shipments this year (this year, the world will probably sell 15Gw of battery modules, Last year increased by more than 100%).

Another newly-listed company, Jingko Energy, also stated that its battery module production capacity may increase by 30% in 2011.

China Merchants Securities researcher Wang Liusheng said that the 30% growth in the photovoltaic industry may be the global growth rate of photovoltaic modules next year. Because polysilicon production capacity will be gradually released next year, plus the possibility of countries subsidizing photovoltaic subsidies, and manufacturers are also increasing the supply of components.

Standard PCB

A Printed Circuit Board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components (e.g. capacitors, resistors or active devices) are generally soldered on the PCB. Advanced PCBs may contain components embedded in the substrate.

PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Conductors on different layers are connected with vias. Multi-layer PCBs allow for much higher component density.

FR-4 glass epoxy is the primary insulating substrate. A basic building block of the PCB is an FR-4 panel with a thin layer of copper foil laminated to one or both sides. In multi-layer boards multiple layers of material are laminated together.

Printed Circuit Boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part.

Here at BentePCB, Standard PCB means manufacture parameter in General requirements, no special features.

Parameter Definition of Standard PCB as below:

Items	Manufacturing Capabilities
Number of Layers	1-16 layers
Material	FR-4
Maximum PCB Size(Dimension)	650x1200 mm
Board Size Tolerance(Outline)	Â±0.2mm/Â±0.5mm
Board Thickness	0.8-1.6mm
Board Thickness Tolerance(tâ‰¥1.0mm)	Â±10%
Board Thickness Tolerance(t<1.0mm)	Â±0.1mm
Min Trace	0.1mm/4mil
Min Spacing	0.1mm/4mil
Copper Thickness	1oz(35Î¼m)
Drill Sizes (CNC)	0.3-6.3mm
Min Width of Annular Ring	0.15mm(6mil)
Finished Hole Diameter (CNC)	0.3mm-6.2mm
Finished Hole Size Tolerance(CNC)	Â±0.08mm
Solder Mask	LPI
Minimum Character Width(Legend)	0.15mm
Minimum Character Height (Legend)	0.8mm
Character Width to Height Ratio (Legend)	1:05
Minimum Diameter of Plated Half Holes	0.6mm
Surface Finishing	HASL with lead
Solder Mask	HASL lead free
	Immersion gold
	Green ,Red, Yellow, Blue, White ,Black
Silkscreen	White, Black, None
Panelization	V-scoring,
	Tab-routing,
	Tab-routing with Perforation (Stamp Holes)

About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB , rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.

Why Us?

UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.