Microsemi's release of image/video solutions to provide secure, reliable, low-power devices for imaging applications

Microsemi Corporation (Nasdaq Stock Exchange: MSCC), a leading provider of differentiated semiconductor technology solutions for power, safety, reliability and performance, announces new image/video solutions For developing reliable low-power video processing applications. The new platform includes a Field Programmable Logic Device (FPGA) Mezzanine Card (FMC), a comprehensive intellectual property (IP) suite, and an Image User Interface (GUI). The FMC plugs into the SmartFusionTM2 Advanced Development Kit, which shows that Microsemi's IGLOOTM2 FPGAs and SmartFusion2 System-on-Chip (SoC) FPGAs support configurable and adjustable camera, image and video designs.

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In addition to modular IP kits and hardware kits, the new image/video solution includes a flexible image sensor interface connector and GUI-based graphical interface software that allows users to configure sensor display presentations in real time. By designing the high-performance FPGA and SoC FPGA devices with a comprehensive, easy-to-learn, easy-to-use development tool set, the Libero SoC design suite makes it easy to reuse designs across multiple platforms. The image/video IP kit is available in the company's Libero SoC IP library, and designers can use the kit for a wide range of camera and display applications in the medical, industrial, automotive, defense and aerospace markets. This solution features low power, reliability and design/data security, including drones, machine vision, robotics, infrared imaging, head-up display technology, target capture systems, medical imaging, surveillance and automotive display technologies. Ideal for a wide range of applications.

Chowdhary Musunuri, Senior Director of Microsemi's SoC Product Group, said: "The high-definition image/video suite and IP set is the key to our continued build of a powerful portfolio of solutions for video and imaging applications, through our low-power proprietary Technology implementation is differentiated from competing vendors. We are pleased to offer this initial kit to customers to accelerate their adoption of Microsemi's FPGA and SoC devices in camera- and display-based designs. And we look forward to releasing more images. Design solutions to meet the specific needs of this market."

The new kit from Microsemi is an FMC-based image video card with a flexible image sensing interface, display interface for 7:1 low voltage differential signaling (LVDS), HDMI connectivity and audio processor. The initial image sensor circuit board provides an image sensor module based on the AR0330 with a parallel bus interface. Future image sensor boards will provide other interfaces such as the Mobile Industry Processor Interface (MIPI) Camera Serial Interface (CSI-2) and High Speed ​​Serial Pixels (HiSPi). In addition, because the hardware is based on FMC, this kit plugged into the M2S150-ADV-DEV-KIT can also be shared with Microsemi's future FPGA and SoC devices.

According to Dependra Lal, senior analyst at market research firm IndustryARC, "The machine vision system market is growing at a rate of 12.6%, and is likely to reach $8.6 billion in 2021. The industry is turning to integrated advanced vision systems and autonomous robots to guide the robot's arm. Providing navigation for robots on production lines further drives the growth of machine vision systems in industrial and medical applications."

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Specifications

Counting speed ≦1500pcs/min(For coins with a diameter of 25mm)
Diameter 14-34.0mm
Thickness 0.8-3.8mm
Hopper capacity 4000pcs
Packing/wrapping speed ≦15packages/min(For coins with a diameter of 25mm.)
Package way Hot iron
Packing bag size Length:100-140mm, Width:100mm
Operation interface HMI
Driving mode Electric
Power requirements AC 220-240V 50Hz
Current AC 6A
Power consumption 1.2KW
Noise < 70dB
Control system PLC XC5-32T-E/C

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