According to Semiconductor's quoted research institute SEMI, the distribution of 180 LED/optoelectronic epitaxial wafer factories (Opto/LED Fab) is the largest in Japan. The Japanese manufacturers have the largest number of LED/optoelectronic epitaxial wafer factories, but the distribution of LED epitaxial wafer factories is ranked by Taiwan, Japan and the mainland are among the top three.
The number of LED factories in Taiwan, Japan and the mainland currently accounts for 40%, 23% and 22% of the world respectively. In 2009, the economy was not good. There are still 7 new LED factories in use around the world. In 2010 and 2011, there are currently 5 and 6 seats to be opened, mainly in mainland China, Taiwan, Japan, India and Russia.
Although Taiwan already has the world's highest LED epitaxial wafer manufacturing capability, Taiwan LED manufacturers including Jingyuan Optoelectronics are still planning to continue investing in 2010 to catch up with the expected future demand of 20~30%. In 2010, the metal organic chemical vapor phase epitaxy (MOCVD) machine is expected to exceed 100 in Taiwan. However, the MOVCD machine manufacturing technology has a high threshold, and whether it can enter the production line as scheduled will have an impact on capacity expansion.
The demand for LED chips is mainly from LED TV. Samsung Electronics Co., Ltd. is expected to add 50 MOCVD machines in response to the rapid growth of LED TV sales, so that Samsung's MOCVD machines will be accumulated to 150 units by the end of 2010.
Nichia, the global leader in LED chips, is expected to complete a new LED epitaxial wafer factory in early 2012, which is expected to increase its current production capacity by a factor of four.
As for Taiwanese manufacturers, AUO and Chi Mei Group are actively deploying the LED industry, with the main purpose of consolidating the ability to produce key components and establishing better vertical integration in the production chain. Because the target of locking is the same, the competition of various manufacturers will be more intense in the long run. However, SEMI estimates that there is no overcapacity problem in the short-term LED epitaxial film.
The optimistic attitude towards the LED industry is also reflected in the investment trend of large technology companies. TSMC has built LED R&D centers and epitaxial wafer factories in Hsinchu. The industry's estimated investment amount is NT$5.5 billion (about US$170 million). With the expansion of the epitaxial wafer manufacturers, the LED industry has entered a new stage.
SEMI analysts said that the LED industry is similar to the early development of the semiconductor industry. The LED industry is entering a growth period. In the future, more international manufacturers are expected to cut into the LED market supply chain, which will reduce the cost of LED manufacturing and increase production capacity.
BGA PCB , it's the PCB that have the pads for BGA parts. BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm.
PCB = printed circuit board and PCBA = printed circuit board assembly. For PCB, it means the copper circuits be printed on a board, and so the main composition of PCB are copper and board.
The copper is the circuits material and the circuits designed by the PCB designers. Depends on the current in the circuits, the PCB copper thickness could be done with 0.5oz-10oz. But the PCB designers need be noted that the copper track width/space need be enlarged with the thickness. For example, the minimum copper track width/space could be 3mil/3mil with 0.5oz, but would be 4mil/4mil with 1oz.
The PCB board could be rigid PCB, could be flex PCB and also could be Flex-Rigid PCB. And the materials could be FR4, PI, Aluminum, Copper-based, Rogers, Teflon, etc. They have different applications. For example, FR4 PCB is the most commonly used for rigid PCB and almost good for all electronics products; PI is the most commonly used for flex PCB; Aluminum and copper-based have good thermal diffusivity and always used for LED PCB ; Rogers PCB and Teflon PCB are always used for High Frequency PCB, etc.
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Features |
Capabilities |
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Layers |
1-36 layers |
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Material |
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PCB Type |
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Board Thickness |
0.1mm-6.0mm |
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Copper Thickness |
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Min Tracing/Spacing |
0.075mm/0.075mm (3mil/3mil) |
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