In August 2010, USHIO Electric Co., Ltd. (Head Office: Tokyo Metropolitan Government, President of the Board of Directors, Shida Shilang, hereinafter abbreviated as USHIO) released the world's first 6-inch full-projection exposure machine "UX4-LEDs"*2 in the LED industry.
Classified by process, LED Chip fabrication can be classified as a branch of semiconductors. In the yellow light process, when manufacturing electrodes, circuits, and protective films on a Sapphire substrate, the same exposure equipment as that produced by the semiconductor is still used. In the Taiwan market, the production of 2, 4 å‹ substrates is still dominated by the Step & Repaet or Contact exposure equipment*3.
However, due to the increased demand for backlight modules and general lighting, as well as more stringent cost considerations in production, the size of LED substrates has gradually expanded from the current 2 to 4 to 6 ,, and various manufacturers have been able to take out more for one substrate. Chip ※4 and work hard. If it is expanded to 6 å‹, a more serious problem of substrate warpage will inevitably occur, and it is impossible to effectively improve the current immersion exposure machine or contact exposure equipment. As a result, the yield of the line or the protective film layer is greatly reduced, which is a practical problem that occurs between the Japanese and Korean industries. In addition, when the size of the substrate is expanded, if the existing equipment is modified, a large cost and an Up-Time loss will occur, and the above phenomenon is a major problem facing the LED industry.
To this end, USHIO uses semiconductors to accumulate experience in projection projectors for a long time, develops LED Chip technology, and develops high-productivity exposure equipment for LED technology - "UX4-LEDs". This equipment not only can effectively overcome the problem of substrate warpage, but also can greatly improve the economic efficiency of productivity and large size by 6å‹ full exposure. Compared with the market's existing reach-type exposure machine, "UX4-LEDs" has doubled the production capacity*5. Even in the future, large-size (8-inch) and "UX4-LEDs" can be upgraded by simply switching the projection Lens, saving the cost and time required for equipment modification and parts, and bringing production closer to full automation.
USHIO is the only manufacturer of exposure machines designed from the source of light source, optical system, mechanical structure, electrical and software. It is based on the long-term cumulative exposure machine Know-how, targeting different customers and different processes. Tailor-made production equipment that best meets customer needs. At the same time, in the future, we will work together with customers to improve product quality and reduce production costs.
The company is expected to participate in "2010 SEMICON" (Exhibition Hall 1 #263*) on September 8-10, 2010. We sincerely invite all manufacturers to visit the USHIO booth. The resident staff will personally target "UX4-LEDs". Detailed explanation of equipment and performance, hope that the future evaluation of your company's LED process can be helpful.
*1 June 30, 2010 (investigation by the company)
*2 USHIO has accumulated more than 20 years of experience in exposure equipment production including semiconductors, FPDs, circuit boards, and MEMS industries, and has accumulated more than 1,000 shipments worldwide (including contact, full projection, and progressive exposure machines). ).
*3 For details on the performance of different exposure methods, see "Exposure Method Comparison Table".
*4 A single substrate can be used for about 10,000 chips and about 60,000 chips.
*5 Condition is 6å‹ substrate (investigation by the company)
USHIO LED Chip Production Full Projection Exposure Machine "UX4-LEDs"
1 6 å‹ one projection exposure machine
When Mask and Wafer are not in contact during exposure, Mask can be prevented from being contaminated by photoresist, and the circuit Pattern can be solved. In addition, Mask cleaning operations are not required, and equipment production time is relatively improved.
Compared with the output speed of the existing ejector exposure machine, the "UX4-LEDs" high-efficiency one-time exposure doubles the production capacity.
2 High alignment accuracy? High resolution capability
Self-developed projection lens, alignment system and conveying mechanism can meet various LED chip process requirements.
? The problem of poor identification of the alignment mark of the Layer such as the transparent electrode can be effectively improved by the TTL (Through The Lens) alignment system, achieving high-precision alignment capability.
The exclusive vacuum suction stage design and Deep Of Focus can effectively solve the problem of large-sized board warping.
3 UPGRADABLE structure design
? Different substrate size products can be automatically switched by Recipe, no manual exchange work is required.
The main component module design facilitates the upgrade of future process requirements and facilitates the convenience of future maintenance.
4 high C / P value
According to the customer's demand, it can save 80% of the CoO compared with the traditional exposure equipment (including the Medieval Diving Exposure Machine). The size of the device body is also lighter than that of the previous generation equipment, and the required CR space is only 3.0m2.
LED Chip production is compared with various types of exposed light machines
Introduction to USHIO Motor Co., Ltd.
USHIO Electric Co., Ltd. (the company: Tokyo Metropolitan Government, Dongzheng 6925) was founded in 1964. Starting from the light source for the production industry, it is extended to various lighting, OA light source and exposure equipment. In addition, various optical components derived from their own light sources are also manufactured and sold, and have obtained a high evaluation and market share in the market. At present, the number of employees of the group (including overseas companies) is about 4,600, and the connected turnover is about ¥120.8 billion. (March 2009 issue)
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