The lighting market using the E17 compact bulb is also very attractive for LEDs.
Sharp has introduced a product that is very close in size to the E17 bulb. Toshiba Lighting Technology has achieved miniaturization by updating the power supply circuit of LED bulbs.
Sharp and Toshiba Lighting Technology have been supplying LED bulbs with a shape close to the E17 compact bulb since February 2010. The E17 bulb market is “a potential market with increasing supply†(Toshiba Lighting Technology Headquarters LED Product Technology Department LED product technology principal and co-worker Sakai), it is expected that E17 bulbs will account for 4 of the domestic bulb market in Japan in 2012 To the left and right.
In order to open up this promising market, Sharp and Toshiba Lighting Technology have challenged with miniaturization technology. Both companies have achieved miniaturization through newly developed power circuits and LED packages.
Invest in the AQUOS Power Development Team
“Development work is completely design-oriented†(Mr. Tao Jingheng, deputy director and commodity planning director of the LED Lighting Business Promotion Center of the Sharp Health and Environmental Protection System Business Division). Sharp is determined to be infinitely close to the E17 bulb dimensions.
In order to achieve miniaturization of the power supply circuit, Sharp has invested in the power development team of the LCD TV "AQUOS". When the power supply circuit used in the original E26 type LED bulb is used directly, the transformer and the electrolytic capacitor are too large to be accommodated in the E17 type bulb. As a result, AQUOS's power development team has dramatically improved the power circuit and changed the previous step-down chopping method to a flyback mode. This has succeeded in replacing electrolytic capacitors with small ceramic capacitors while significantly reducing the size of the transformer.
By reducing the size of the transformer and changing the capacitors, Sharp has reduced the power supply circuit to a size (a, b) that can be stored in the E17 type product. A package (c) capable of mounting LED chips at high density has also been newly developed.
However, in order to achieve miniaturization, it is necessary to use electronic components higher than the original price. In order to control the increase in cost, Sharp reduced the purchase price of electronic components by increasing the output of LED bulbs. The previous LED bulbs were manufactured at a scale of 200,000 per month, and this time it has increased to 500,000 per month. “From the point of view of using semiconductors and electronic components, lighting is the same as digital home appliances. Cost reduction can be achieved through mass production.â€
Another element contributing to miniaturization is the newly developed LED package, which mounts 40 blue LED chips into a 12mm x 15mm package. Originally, the method of arranging several mm square package planes with several blue LED chips was used, so that the required number of E17 type LED bulbs could not be provided.
Sharp began mass production of blue LED chips from the beginning of 2010 before supplying E17 LED bulbs. It was provided to the company at the time, and some of the E17 LED bulbs used this blue LED chip.
Miniaturization with 4-layer backplane
Toshiba's lighting technology replaces the printed circuit board of the power supply circuit with a two-layer product from a two-sided product, and also replaces electronic components such as electrolytic capacitors into small products, thereby achieving miniaturization. It is reported that this is the first time that the company's LED bulbs use a 4-layer printed backplane.
Toshiba Lighting Technology reduced the floor area (a) by replacing the two-sided base plate with a four-layer base plate. The company's self-developed mounting device (b) was used to make the LED package. The photo is for Toshiba Lighting Technology.
The cost of replacing the printed backplane from two-sided products to four layers and using small electronic components is offset by reducing the manufacturing cost of other components. For example, changing the manufacturing process of a resin hemispherical shield called glove also minimizes the amount of resin used for exothermic heat.
The LED package is miniaturized by accommodating 56 blue LED chips in one package. In order to equip LED chips with high density, Toshiba Lighting Technology has independently developed installation equipment, and blue LED chips are purchased from outside.
Toshiba Lighting's E17 LED bulbs feature sealed-type appliances. In contrast, Sharp did not support sealed appliances because of the "difficulty in verifying multiple appliances due to the lack of lighting fixtures."
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