Shanghai, China, March 9, 2010 - Linde Group, the world's leading gas and engineering company, announced that it has developed a state-of-the-art packaging solution for flexible displays in the United Nations 211 project, Shanghai University, to achieve production quality. Increase and reduce costs.
Linde plans to conduct joint project research and development with the university's research center, "Key Laboratory of New Display Technology and Application Integration" (new display technology laboratory) in the new gas application technology in the manufacturing and packaging process of flexible display. Linde will first invest RMB 800,000 (80,000 Euros) as the first phase of R&D project funding.
The collaborative project aims to develop new thin film packaging technologies and packaging materials for flexible displays, especially in flexible organic light-emitting device (OLED) production processes. In this cooperation, Linde and the new display technology laboratory will jointly develop single and composite structural thin film materials, related gas application processes, and research on the interaction between display devices and different package structures and processes.
Traditional packaging materials and technologies have become the bottleneck for the development of flexible organic light-emitting displays because they are not suitable for the future development of high-efficiency, thin and flexible displays and their own costs.
The research results of Linde and Shanghai University's new display technology laboratory are expected to provide a flexible, flexible and cost-effective device packaging solution for the flexible display industry, which will effectively support the future display consumer market to be more advanced and integrated. Product requirements. With the evolution of new product designs and new production technologies, the market for flexible OLEDs is growing. Research shows that OLED has entered a stage of rapid development, and its global shipments are expected to increase from 76 million in 2007 to 227 million in 2012.
Christoph Laumen, Director of Global Electronic Packaging Application Development at Linde Group, said: “One of Linde’s values ​​is to serve customers with innovation. In order to achieve this commitment, Linde’s R&D centers around the world have been working for us. Customers develop gas-related application technologies and develop new technology solutions for the industry through active cooperation with leading universities and research institutes at home and abroad. Our application technologies include process equipment, process technology and gas engineering technology. Germany focuses on innovative solutions for sustainable development in the future and contributes to the growth of the growth market."
Linde’s grant fund will support the materials, gases, equipment and analytical testing required for the experiment. In addition, engineers from the Linde R&D Center in Shanghai will also participate in the development of the project. At the end of 2010, the two sides plan to conduct a comprehensive assessment of the progress of the project and prepare for further research and development.
Professor Zhang Jianhua, executive director of the new display technology laboratory and leader of the semiconductor optoelectronics project, said: "The new display technology laboratory of Shanghai University is a laboratory supported by the Ministry of Education and the Shanghai Municipal Government. It has rich research in organic display and liquid crystal display. Accumulation and extensive industry communication. Through cooperation with Linde Group, we are very eager to see a unique film-forming process that can make breakthroughs in flexible organic display, organic electronics packaging and manufacturing, and combine technical solutions for innovative gas applications. To improve the quality, working life and cost of flexible organic display products."
This collaboration with Shanghai University is one of Linde's several application development projects in the electronics industry. Linde also maintains ongoing collaboration with several other research institutions, including the Fraunhofer Institute, Tsinghua University and the Hong Kong Polytechnic University, covering chip packaging, circuit board manufacturing and assembly.
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