At present, due to the quality and price of GaN-based LEDs, it can only work on special lighting. Efforts to improve quality and lower prices to get into general lighting as soon as possible are one of the most important tasks.
In recent years, the efficiency of LED light sources has increased rapidly. In the past 6 or 7 years, the efficiency has increased by 4 to 5 times. At the same time, the cost is also decreasing, and the decline is very fast. Enterprises should fully consider this in order to avoid risks in the new round of investment and expansion. A development trend.
The main technical problems of current LEDs are to improve luminous efficiency, reduce light decay and reduce costs. Judging from the technical indicators completed in previous years, the development of semiconductor lighting technology is much faster than originally planned. Luminous efficiency market power LED products have reached 130lm/W.
The current high procurement costs are the main obstacle to green lighting. For the development of LED industry in mainland China, it is recommended that breakthrough new technologies be germinated and grown. New technologies are not only a means of drastically reducing costs, but also the core of independent innovation.
Holonyak, the inventor of the light-emitting diode (LED), published an article on the JPS of the American Physical Society in 2000, "Is the light-emitting diode the final form of the lamp?", "In principle, the LED is the final form of the lamp, and in fact So, its development can and will continue until all power and color are achieved. It is extremely important to understand this." Ten years later, this view is being confirmed. LED lighting applications are rapidly evolving and technology is constantly making breakthroughs. At the "12th National LED Industry Seminar and Academic Conference" held on September 9, we saw that China's LED process technology has made rapid progress, but at the same time, hardware equipment is becoming a bottleneck for development, especially MOCVD (organic Core equipment such as metal chemical vapor deposition is constraining the development of the industry.
Technological progress, fast hardware equipment to be broken
The "12th National LED Industry Seminar and Academic Conference" was held in Shenzhen recently. As a national major academic conference, the seminar fully demonstrated the latest research results of the LED industry chain. From the report of the academic conference, we feel that China's LED process technology has indeed made rapid progress, especially the rapid progress of silicon substrate LEDs, attracting the attention of the industry. At the same time as the rapid advancement of LED technology, hardware equipment has not seen breakthroughs, and core equipment, especially MOCVD equipment, is becoming a bottleneck in industrial development. The investment boom triggered by MOCVD equipment is becoming a major concern in the industry.
Since the launch of the semiconductor lighting project in the country in 2003, China's semiconductor lighting industry and technology have made significant progress, initially forming a relatively complete R & D and industrial system in the upper, middle and lower reaches, and entering a stage of rapid development. The LED manufacturing technology based on enterprises is progressing rapidly, and the power efficiency of the power chip package completed by the enterprise industrialization line reaches 80lm/W to 100lm/W. The power-based Si substrate LED chip with independent intellectual property rights has a luminous efficiency of 78lm/W, which is at the international advanced level.
At present, the mainstream substrate of the GaN-based LED industry in the world is sapphire, and a small number of companies use SiC substrates and Si substrates. The Si substrate is inexpensive and has excellent electrical conductivity, but the mismatch between Si and GaN is large, the epitaxial GaN dislocation density is high, and cracking is liable to occur, and it is very difficult to obtain a high quality GaN epitaxial layer. Recently, Nanchang University has made great progress in growing GaN-based blue LEDs on Si substrates, and the luminous efficiency has reached 116.7 lumens, reaching the highest level of similar products.
At the same time, its technology has also been strictly patented, and its progress in large-scale industrialization is of great significance for improving the international status of LED technology patents in China. The successful development of GaN LED chip on Si substrate has rewritten the history of GaN LED with sapphire and SiC as the substrate, which has opened up a new technical route for LED to general illumination. From the reaction of this meeting, silicon substrate LEDs are becoming the focus of the industry, and silicon substrate LED technology carries too much hope in the industry.
The progress of LED technology is very fast. At the same time of rapid advancement of process technology, hardware equipment has not achieved breakthroughs. In particular, there is no mature domestic equipment, and a large number of core equipment needs to be imported, which seriously restricts the development of LED technology and industry.
MOCVD equipment imports surged industrial development risks
According to incomplete statistics, about 30 units in China have already announced or are planning to build LED epitaxial chip projects. The number of MOCVD equipment invested in it is between 1,400 and 1,600, and the actual number is likely to be between 500 and 600.
Why is there such a large investment? Ren Zhongxiang, deputy general manager of Shandong Inspur Huaguang Optoelectronics Co., Ltd., believes that the guidance of wrong data has made politicians and entrepreneurs enthusiastic. "LED epitaxial wafers and chips account for about 70% of the industry's profits, LED packaging accounts for about 10% to 20%, and LED applications also account for 10% to 20%." From the perspective of China, this is a wrong data. According to the survey, the profit of the packaging industry and the application industry is between 3% and 10%. According to the average of 6%, the profit of China's packaging and application in 2009 was about 4.8 billion yuan, and the total output value of China's epitaxy and chips in 2009 was only 2.3 billion yuan, so it is wrong to say that LED epitaxial wafers and chips account for about 70% of the industry's profits. This erroneous data has made people's investments desperately invested in the epitaxial wafer and chip industries.
Peng Wanhua, secretary general of the Fujian Optoelectronics Industry Association, believes that from the analysis of the LED market and the possible investment trends, the current domestic investment in LED epitaxy and chips is overheated because the market capacity is not so large. Guan Baiyu, deputy inspector of the Department of Electronics and Information, Ministry of Industry and Information Technology, stressed that LED enters the field of lighting and embodies the characteristics of multi-technology integration. It belongs to high-end technology and products and needs to have a strong industrial base and technical foundation to support development and related. Application, I hope investors can have a full understanding of this, do market analysis and product positioning, do a good investment plan and investment plan, and effectively avoid investment risks.
Yue Jianshui, deputy general manager of Shanghai Dachen Optoelectronics Technology Co., Ltd. believes that with the improvement of technology, the development of specialization, and the establishment of the brand, the entire LED industry will inevitably develop into a “guerrilla warfare†that has poured into the market. ", then to the "system war" led by the brand. Therefore, industrial concentration will become higher and higher. In this process, capital has become the biggest pusher. Industry reshuffle and integration are imperative.
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