[Text|High-tech LED reporter Gan Qin] The 2014 Gaogong LED Annual Meeting was held at the Guanlan Lake Dongguan Club in Shenzhen on December 12-13. On the afternoon of the 12th, the first theme conference was held by Zhongweiguang Electronics. Zheng Xiantao, general manager of the Photoelectric LED Business Unit, gave a keynote report titled "New Opportunities for Flip Chip Packaging."
The so-called flip chip package, that is, the flip-chip LED chip is assembled and soldered on the bracket, and then encapsulated by a silicone gel to prepare a leadless package LED device. This packaging process solves the heat dissipation problem of the packaged device under high current and high power operation, and improves the reliability of the device. In recent years, this technology has been favored by more and more LED manufacturers due to its good current expansion and light output characteristics.
Getian Optoelectronics has always been at the forefront of technology. Three years ago, the company saw the development prospects of flip chip technology, and took the lead in developing a flip-chip LED integrated light source, writing a brilliant page in the history of Getian Optoelectronics.
At this high-tech meeting, Zheng Xiantao confirmed from the three aspects of “stabilityâ€, “high cost performance†and “flexibility†that the flip chip package will “innovate infinitely†in future applications, and conclude that the flip chip package will Become the technology of choice for future outdoor lighting.
Zheng Xiantao said that the positive-loading chip package form is mainly electrically connected through a gold wire, and the impact of a large current is extremely easy to burn the gold wire. The flip-chip LED integrated light source eliminates the need to hit the gold wire, and the probability of dead light is reduced by 90%, thus ensuring the stability of the product.
The high cost performance is reflected in the huge cost space. Zheng Xiantao mentioned that in the field of LED street lamps, the design of street lamps using COB or single combination has the problem of high heat dissipation cost. If the flip chip module is used, the light source design can be done. Lighter, the TC point temperature can withstand higher temperature resistance, the overall cost is lower, and aluminum is used less.
In addition, the flip chip package greatly improves stability and eliminates labor costs by eliminating the use of wire bonding equipment.
Based on the above advantages, Zheng Xiantao believes that the high-density integrated module of flip chip is very suitable for professional fields, such as stage, automobile, projection, special lighting, such as searchlights and other special lighting markets. In the next step, Getian Optoelectronics plans to introduce flip chip technology into the general lighting market, especially in the outdoor lighting market where Getian Optoelectronics has an advantage, including street lamps, tunnel lights and landscape lighting markets.
Zheng Xiantao also mentioned that in the future, the realization of downward and outward extension, continuous innovation and change of mode, complementation of strong and strong joint advantages, and transformation from manufacturing service industry will become a higher-through and far-reaching through-train for LED packaging enterprises.
Zheng Xiantao, General Manager of Getian Optoelectronics LED Division
The so-called flip chip package, that is, the flip-chip LED chip is assembled and soldered on the bracket, and then encapsulated by a silicone gel to prepare a leadless package LED device. This packaging process solves the heat dissipation problem of the packaged device under high current and high power operation, and improves the reliability of the device. In recent years, this technology has been favored by more and more LED manufacturers due to its good current expansion and light output characteristics.
Getian Optoelectronics has always been at the forefront of technology. Three years ago, the company saw the development prospects of flip chip technology, and took the lead in developing a flip-chip LED integrated light source, writing a brilliant page in the history of Getian Optoelectronics.
At this high-tech meeting, Zheng Xiantao confirmed from the three aspects of “stabilityâ€, “high cost performance†and “flexibility†that the flip chip package will “innovate infinitely†in future applications, and conclude that the flip chip package will Become the technology of choice for future outdoor lighting.
Zheng Xiantao said that the positive-loading chip package form is mainly electrically connected through a gold wire, and the impact of a large current is extremely easy to burn the gold wire. The flip-chip LED integrated light source eliminates the need to hit the gold wire, and the probability of dead light is reduced by 90%, thus ensuring the stability of the product.
The high cost performance is reflected in the huge cost space. Zheng Xiantao mentioned that in the field of LED street lamps, the design of street lamps using COB or single combination has the problem of high heat dissipation cost. If the flip chip module is used, the light source design can be done. Lighter, the TC point temperature can withstand higher temperature resistance, the overall cost is lower, and aluminum is used less.
In addition, the flip chip package greatly improves stability and eliminates labor costs by eliminating the use of wire bonding equipment.
Based on the above advantages, Zheng Xiantao believes that the high-density integrated module of flip chip is very suitable for professional fields, such as stage, automobile, projection, special lighting, such as searchlights and other special lighting markets. In the next step, Getian Optoelectronics plans to introduce flip chip technology into the general lighting market, especially in the outdoor lighting market where Getian Optoelectronics has an advantage, including street lamps, tunnel lights and landscape lighting markets.
Zheng Xiantao also mentioned that in the future, the realization of downward and outward extension, continuous innovation and change of mode, complementation of strong and strong joint advantages, and transformation from manufacturing service industry will become a higher-through and far-reaching through-train for LED packaging enterprises.
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