Wearable medical design challenges and development bottlenecks

According to reports, it is estimated that by 2017, the market sales of China's wearable medical equipment will be nearly 5 billion yuan. In the face of such huge potential, Samsung, SONY, Apple, Huawei, ZTE and other domestic and foreign semiconductor giants have all been involved in wearable medical equipment. At one time, all kinds of wearable medical products flooded the market, but the market has not ushered in point.

Xi Jinmiao, an senior market engineer in the medical and wireless category of ON Semiconductor, said that the current domestic medical system faces challenges such as shortage of doctor resources, uneven distribution, and insufficient government medical investment. Thanks to the development of semiconductor and Internet technologies, some small portable medical diagnostic equipments have been able to measure and monitor human body parameters, and send data to remote medical diagnostics for analysis and then feedback to patients. Telemedicine, the blueprint for future wearable medicine has begun to take shape.

However, the wearable medical market is still in the early stage of development, and the accuracy, size and power consumption of the products cannot meet the needs of users. And because the threshold of wearable products is low, large and small manufacturers are swarming in, causing users to scream, and the market is out of date. Wearable products still need to undergo several changes to improve related services and build the industry chain.

Xi Jinmiao, Senior Market Engineer, ON Semiconductor Medical and Wireless

Xi Jinmiao said, how to control equipment power consumption, extend battery life, how to achieve high integration dedicated analog front end and dedicated control system, miniaturize products, how to ensure the effectiveness and sharing of monitoring data, will become a wearable medical equipment The main challenge that is not faced.

On the other hand, for wearable products, the core part is mainly concentrated on SoC, and most wearable products on the market use mobile phone chips, which are used in smaller wearable products. The power consumption is reduced, and the power consumption cannot be reduced. The user experience is more like talking about it. Therefore, for wearable products, product performance is inseparable from industry applications and SoC integration.

As a leading semiconductor supplier to the medical device market, ON Semiconductor offers everything from complex system-on-chip (SoC) for hearing aids to application-specific integrated circuits (ASICs) and specialized standard products for implant devices, digital imaging and medical diagnostic equipment. Successful applications for a wide range of products such as (ASSP) include defibrillators, pacemakers, hearing aids, and patient monitoring electrocardiographs (ECGs). Xi Jinmiao introduced the RHYTHM R3110 hybrid circuit from ON Semiconductor, which is a pre-qualified digital signal processor (DSP) system for hearing aids. This chip requires no software configuration, is a simple, cost-effective solution, but also provides the performance required in high-end hearing aids, including self-use noise suppression and adaptive feedback cancellation, and uses a highly integrated packaging process, the size is only 5.08 X 3.1 X 1.0 mm.

The wearable field is still in the development stage. Many manufacturers are testing the water. Although the future is bright, it is difficult for users to dig their own needs at present, and there are few good products in the market. At the same time, technical barriers still exist. How to combine targeted industrial applications and China's current medical environment to launch targeted high-integration solutions, becoming a first consideration for semiconductor manufacturers who want to take a share in the domestic medical market. Although there is a long way to go, but in any case, we should give hope to wearable medicine.

   This article is selected from the high-end interview column of the "Electronic Medical Special Issue" in the electronic enthusiast network in September. Please indicate the source!

  

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