Since the life and luminous efficiency of the LED bulb will decrease when the operating temperature of the LED bulb is increased, the degree of color shift and light decay will increase, and the LED illumination will have a rather adverse effect, so how to limit the LED bulb Among the space, heat dissipation in the most efficient way has long been the focus of R&D and design of LED lighting manufacturers.
Generally speaking, the waste heat generated by the diode in the LED bulb is guided by a number of components such as Slug, Board, etc., and then discharged into the surrounding atmosphere, and the heat is transferred to the diode and Slug, Slug and The board is mainly based on the heat conduction type. As for the board to be transported to the atmosphere, there are three types of heat conduction, heat convection and heat radiation. When planning the heat dissipation design of a product, the LED lighting industry can first analyze the heat dissipation of the conduction process to calculate the thermal resistance value in each segment, and then improve the poor performance. This way of solving the heat dissipation problem will be more effective.
Analyze the form of heat conduction to solve the problem of LED heat dissipation
Taking the improvement of heat conduction efficiency as an example, we can reduce the thermal resistance of this part by trying to increase the geometrical area of ​​the Slug/Board or directly using a high thermal conductive material to make the heat dissipating component. For the problem of diffusion heat resistance between diodes and Slug, Slug and Board due to the difference in area and temperature distribution, Jian Guoxiang suggested reducing the area ratio, increasing the thickness of the component substrate, and increasing the heat transfer coefficient of the material itself. And to strengthen the effect of heat convection ... and so on. Increasing the thickness of the base plate is a common practice. When the thickness is increased, the difference effect caused by the area ratio can be reduced, and the heat will be more uniform in the vertical direction and the horizontal diffusion to the sides, so that the influence of the diffusion heat resistance problem becomes smaller.
If the thickness of the bottom plate cannot be increased due to space considerations, the operator may also strengthen the heat transfer coefficient in the lateral direction of the bottom plate by increasing the heat pipe... to shorten the difference between the vertical and horizontal heat conduction. This means that the higher the thickness of the bottom plate, the higher the benefit of increasing its lateral heat transfer coefficient. Although the increase in thickness reduces the diffusion thermal resistance, it also increases the one-dimensional thermal resistance value. The industry must try to strike a balance between the two through experimentation and calculation to find the best thickness at the bottom. But in general, when the difference in area between the diode and Slug, Slug, and Board is greater, the optimal thickness will increase.
The main circuit of the equipment is the full bridge controlled circuit and the trigger circuit is the programmable integrated circuit. The phase-shifting, fixed width and modulation of the pulse are all digitized, and it does not need any adjustment for the section of the trigger. It has the features of high reliability, high pulse symmetry, strong anti-interference ability, quick reaction, as well as the advantages of no heat-generating, constant current, energy-saving which is compared with the discharge with the electrical resistance.
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