Mobile phone camera anti-shake technology detailed

Smartphone pixels for 5Meg, 8Meg, and 12Meg high-pixel cameras are getting closer and closer to DSC. But high-pixel phone cameras don't contain some optical or mechanical parts of the DSC. This lack of hardware will undoubtedly make the camera phone's photo effect worse than the DSC.

The introduction of anti-shake technology can make the effect of high-pixel camera closer to DSC. Now our camera's anti-shake technology mainly uses the following: OpTIcal Image Stabilizer (OIS), mobile CMOS chip surface, algorithm anti-shake, JPEG transmission, High-ISO, MIPI transmission. Among the listed technologies, we use algorithmic anti-shake, JPEG transmission, High-ISO, MIPI transmission at this stage. OIS is expected to be used in the future. The following is a description of several commonly used methods of anti-shake.

1, OIS

The anti-shake through the lens group mainly relies on the magnetically wrapped suspension lens, thereby effectively overcoming the image blur caused by the camera vibration, which is more effective for the digital camera of the large zoom lens. Usually, the gyroscope in the lens detects a small movement, and transmits the signal to the microprocessor to immediately calculate the amount of displacement to be compensated, and then compensates the lens group to compensate according to the lens's shaking direction and displacement amount, thereby effectively Overcoming the blurring of the image caused by the vibration of the camera. The effect of the optical image stabilization function is quite obvious. Under normal circumstances, turning on this function can increase the shutter speed of 2-3 speeds, so that the hand-held shooting will not be blurred, which is very obvious for beginners. In telephoto digital cameras, the effect is immediate.

2, the algorithm is anti-hand shake

Electronic anti-shake technology utilizes dynamic vectors for jitter detection. According to the motion vector, the swing direction and the swing amount of the image are grasped, and the image position is moved in parallel with reference to generate a jitter-free dynamic image.

3, High-ISO anti-hand shake

Now APTINA, OVT, FUJITSU, and NEC all use the High-ISO method to prevent hand shake. This anti-shake effect has an effect on the image, which is to introduce a certain noise, but this is the cheapest anti-shake. The way is easy to implement.

BGA PCB , it's the PCB that have the pads for BGA parts. BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. Common grids are nowadays: 1.27 mm - 1.00 mm - 0.80 mm - 0.50 mm.

 

PCB = printed circuit board and PCBA = printed circuit board assembly. For PCB, it means the copper circuits be printed on a board, and so the main composition of PCB are copper and board.

 

The copper is the circuits material and the circuits designed by the PCB designers. Depends on the current in the circuits, the PCB copper thickness could be done with 0.5oz-10oz. But the PCB designers need be noted that the copper track width/space need be enlarged with the thickness. For example, the minimum copper track width/space could be 3mil/3mil with 0.5oz, but would be 4mil/4mil with 1oz.

 

The PCB board could be rigid PCB, could be flex PCB and also could be Flex-Rigid PCB. And the materials could be FR4, PI, Aluminum, Copper-based, Rogers, Teflon, etc. They have different applications. For example, FR4 PCB is the most commonly used for rigid PCB and almost good for all electronics products; PI is the most commonly used for flex PCB; Aluminum and copper-based have good thermal diffusivity and always used for LED PCB ; Rogers PCB and Teflon PCB are always used for High Frequency PCB, etc.

 

We are the one-stop shop for all kinds of PCB manufacture service from PCB Prototype to big volume, which could save our customers a lot of time and money.

 


PCB Manufacture Capabilities

 

Features 

 Capabilities

Layers

1-36 layers

Material

 FR-4, Aluminum, Copper, Polyimide, high frequency (Rogers, PTEE, PI), etc.

PCB Type

FR-4 Standard PCB , Aluminum PCB , Copper-based PCB, HDI PCB , Rigid-Flex PCB, Flex PCB, Thick Copper PCB and Rogers PCB, etc.

Board Thickness

0.1mm-6.0mm

Copper Thickness

1/2oz-6oz(18um-210um)

Biggest Board size

600mm*1200mm

Min Tracing/Spacing

0.075mm/0.075mm (3mil/3mil)

Min drilling Hole diameter

0.15mm(6mil), 0.1mm(4mil)-laser drill

Solder Mask

Green, Black, White, Red, Yellow, Blue and Purple, etc.

Silkscreen color

White, Blue, Black, Red, Yellow

Surface finish

HASL Lead free, Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP, Carbon oil, etc.

Special Techniques

Impedance Control, Gold Fingers, Blind/Buried vias, Peelable solder mask, Half holes, Via-in-Pad and Countersink hole, etc.


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